Trupti Deshpande is the Sr. Package Design Engr. at Qualcomm based in Santa Clara, California, United States.
Trupti Deshpande
Sr. Package Design Engr. at Qualcomm in Santa Clara, California, United States
Verified profile
t***@qualcomm.com
Job Title
Sr. Package Design Engr.
Company
Qualcomm
Location
Santa Clara, California, United States
Seniority
Senior
Work Email
t***@qualcomm.com
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Colleagues at Qualcomm
Other verified contacts at Qualcomm.
Emmanuel TagoeAudio Voice Subsystem Engineer at QualcommSai ChennapragadaSoftware Test Engineer at QualcommHannes PessentheinerSenior Engineer at QualcommThirupathi ChLead Engineer, Sr at QualcommAbhishek TyagiStaff Engineer at QualcommMao FengSenior Software Engineer at QualcommNellaiappan SStaff Engineer at QualcommRanganath DuggiralaSoftware Engineer at Qualcomm
Other people named Trupti Deshpande
Different professionals who share this name.
Trupti DeshpandeHuman Resources Executive at Network People Services Technologies Pvt LtdTrupti DeshpandeAccounts Officer at Network Labs India Pvt LtdTrupti DeshpandeSenior Software Engineer at XeroxTrupti DeshpandeAdmissions Counselor at The Chopras Shaping Lives and CareersTrupti DeshpandePublicity Head and Race Incharge at National Education Foundation
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Trupti Deshpande's work email follows the pattern t***@qualcomm.com. Reveal it free.
What does Trupti Deshpande do?
Trupti Deshpande is the Sr. Package Design Engr. at Qualcomm.
Where is Trupti Deshpande based?
Santa Clara, California, United States.
Who is the Sr. Package Design Engr. at Qualcomm?
Trupti Deshpande.
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