Tan Lillian

Package Design Engineer at Intel Corporation in Shanghai, Shanghai, China

Verified profile t***@intel.com
Job Title
Package Design Engineer
Company
Intel Corporation
Location
Shanghai, Shanghai, China
Seniority
Entry
Work Email
t***@intel.com
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Tan Lillian is the Package Design Engineer at Intel Corporation based in Shanghai, Shanghai, China.

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Tan Lillian is the Package Design Engineer at Intel Corporation.

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Shanghai, Shanghai, China.

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Tan Lillian.

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