Qifu Wei is the Engineering Director-- System in Package(SiP)&On-Chip Passive(IPD) System Dept. at Xpeedic Technology Inc based in Shanghai, Shanghai Shi, China.
Qifu Wei
Engineering Director-- System in Package(SiP)&On-Chip Passive(IPD) System Dept. at Xpeedic Technology Inc in Shanghai, Shanghai Shi, China
Verified profile
q***@xpeedic.com
Job Title
Engineering Director-- System in Package(SiP)&On-Chip Passive(IPD) System Dept.
Company
Xpeedic Technology Inc
Location
Shanghai, Shanghai Shi, China
Seniority
Director
Work Email
q***@xpeedic.com
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Other verified contacts at Xpeedic Technology Inc.
Max CangHead of Global Marketing at Xpeedic Technology IncFeng LingPresident at Xpeedic Technology IncEdward TsueiDirector of Sales, US at Xpeedic Technology IncSting ZhaoSenior Application engineer at Xpeedic Technology IncJason YinDesign Service Manager at Xpeedic Technology IncLiguo JiangEngineering Manager at Xpeedic Technology IncChanghua WanLead Application Engineer at Xpeedic Technology Inc
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What does Qifu Wei do?
Qifu Wei is the Engineering Director-- System in Package(SiP)&On-Chip Passive(IPD) System Dept. at Xpeedic Technology Inc.
Where is Qifu Wei based?
Shanghai, Shanghai Shi, China.
Who is the Engineering Director-- System in Package(SiP)&On-Chip Passive(IPD) System Dept. at Xpeedic Technology Inc?
Qifu Wei.
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