Jungjoo Lee

Packaging R&D Engineer at Intel Corporation in Portland, Oregon, United States

Verified profile j***@intel.com
Job Title
Packaging R&D Engineer
Company
Intel Corporation
Location
Portland, Oregon, United States
Seniority
Entry
Work Email
j***@intel.com
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Jungjoo Lee is the Packaging R&D Engineer at Intel Corporation based in Portland, Oregon, United States.

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Jungjoo Lee is the Packaging R&D Engineer at Intel Corporation.

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Portland, Oregon, United States.

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