Bok Lim is the Senior Media Packaging Engineer at Intel Corporation based in Gelugor, Penang, Malaysia.
Bok Lim
Senior Media Packaging Engineer at Intel Corporation in Gelugor, Penang, Malaysia
Verified profile
b***@intel.com
Job Title
Senior Media Packaging Engineer
Company
Intel Corporation
Location
Gelugor, Penang, Malaysia
Seniority
Senior
Work Email
b***@intel.com
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Stephen ByrneProcess Engineer at Intel CorporationOliver DMDF Analyst | Intel Sales Process Team at Intel CorporationAfua AmponsahSenior Process Engineer at Intel CorporationMohammad Mojahidself at Intel CorporationEvelyn NoseEng. Tech at Intel CorporationAlfred GarciaProduct Test Engineer at Intel CorporationKunal VaidyaComponent Design Engineer at Intel CorporationSam McNearEngineering Tech at Intel Corporation
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What is Bok Lim's email address?
Bok Lim's work email follows the pattern b***@intel.com. Reveal it free.
What does Bok Lim do?
Bok Lim is the Senior Media Packaging Engineer at Intel Corporation.
Where is Bok Lim based?
Gelugor, Penang, Malaysia.
Who is the Senior Media Packaging Engineer at Intel Corporation?
Bok Lim.
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