Ahmed Abdelnaby is the Thinning and Bonding Process Development Engineer, Advanced Packaging TD at Micron Technology based in Boise, Idaho, United States.
Ahmed Abdelnaby
Thinning and Bonding Process Development Engineer, Advanced Packaging TD at Micron Technology in Boise, Idaho, United States
Verified profile
a***@micron.com
Job Title
Thinning and Bonding Process Development Engineer, Advanced Packaging TD
Company
Micron Technology
Location
Boise, Idaho, United States
Seniority
Entry
Work Email
a***@micron.com
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Josh KeplerInside Sales Representative/Customer Sales Operations Specialist at Micron TechnologyCanon LavertyESD Engineer at Micron TechnologyCarlo CatalaniProduction Area Flow Lead at Micron TechnologyTony LindenbergManager - Package PWF - Thin/Bond at Micron TechnologyEric HuangFirmware Engineer at Micron TechnologyMariangela CardileCapital Planning engineer at Micron TechnologyNathaniel WillisShift Reticle Technician at Micron TechnologyYongqiang Huangsoftware engineer at Micron Technology
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Ahmed Abdelnaby's work email follows the pattern a***@micron.com. Reveal it free.
What does Ahmed Abdelnaby do?
Ahmed Abdelnaby is the Thinning and Bonding Process Development Engineer, Advanced Packaging TD at Micron Technology.
Where is Ahmed Abdelnaby based?
Boise, Idaho, United States.
Who is the Thinning and Bonding Process Development Engineer, Advanced Packaging TD at Micron Technology?
Ahmed Abdelnaby.
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